New Physical Verification System from Cadence

Si2 Forms New Open Modeling Coalition OMC will address critical issues -- such as accuracy, consistency, security, and process variations -- in the characterization and modeling of libraries and IP blocks used for the design of integrated circuits. The initial OMC Working Groups (WG) will address the proposed library standards for Effective Current Source Model (ECSM), Data Model Consistency, Statistical Timing and Characterization Data.

Structured ASICs to Solve Cost and Design Issues in the IC Industry See last week's Editorial

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Synopsys Extends Galaxy Design Platform with JupiterIO for Concurrent Die and Package Floorplanning and Analysis

New Product Announcement: EverCAD to Deliver the Next Generation All-in-One Mixed-Signal Verification Solution, DIAMOND, for Complex Mixed-Signal SoC designers.

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CheckSum Provides Low-Cost In-Circuit with Boundary-Scan Test; Low-Cost Test Platform Delivers In-Circuit with Boundary-Scan Test for Under $70,000

MagnaChip Semiconductor Launches a One-Chip Solution for the Digital Still Camera Application Market

STMicroelectronics Publishes Certified EEMBC Results for VLIW Core Used in High Performance Embedded Consumer Applications

STMicroelectronics Introduces Step-Change in CPU Performance in Set-Top Box Decoder Chip

WiSpry Names Nathan Silberman Vice President of Engineering

SMSC Reports 58% Year-Over-Year Increase in Second Quarter Revenues, Including Oasis Acquisition; Revenues and Earnings Exceed Company's Prior Estimates

ANADIGICS Raises Third Quarter 2005 Guidance

Structured ASICs to Solve Cost and Design Issues in the IC Industry

North American Semiconductor Equipment Industry Posts August 2005 Book-To-Bill Ratio of 1.05

Jetstream Media Technologies Announces Two New IP Core Products; Products to enable embedded digital effects for consumer electronic devices

Knowlent Joins VSIA to Improve Analog IP Verification

AMCC Sets New Standard for SATA II Hardware RAID With High Performance 3ware 9550SX Controllers; Available Now, 3ware 9550SX Hardware RAID Controllers Set the High Water Mark for I/O Performance

Toshiba Announces New High Efficiency, Space Saving Multi-Chip Module for DC-DC Converters

Semtech Leverages Packaging, Process Innovations in New 3.3V ESD Protection Device; New uClamp3324P Comes in Leadless Package That is up to 77% Smaller Than Competing Solutions; Flow-Through Design Simplifies Board Layout

Spansion Demonstrates High-Density Flash Memory Solutions Based on 90nm MirrorBit Technology

Conexant Expands India Management Team; Industry Veterans Fill President and Chief Operating Officer Positions

Legerity Unveils Industry's Most Integrated VoWiFi Handset Chip and Software; The Le8100 WiFi Product Bundle Redefines Voice-over-WiFi SIP Telephony by Making It More Economical, Adaptable, and Power-Efficient

Low-Power Tuner from Zarlink Targets Standard- and High- Definition Digital Satellite PayTV Systems

National Semiconductor Delivers Multiple Innovations in Ethernet Transceivers

Atmel Introduces First Power Management IC for Handset Add-on Modules

White Electronic Designs Awarded $1.9 Million Contract for System-On-Chip Microprocessor Modules for Air-to-Air Missiles

picoChip and ARM Announce 90NM Next-Generation Wireless Chipsets

Broadcom's New Enterprise IP Phone Chip Brings Next-Generation Features and Capabilities to Mid-Range IP Phones

Achronix Semiconductor Corporation Announces 650MHz FPGA and Early 2006 Release of 1+GHz Product

Airgo Unlocks Door to Digital Home With First Wireless Chip to Outstrip Wired Speeds

Fairchild Semiconductor's European Global Power Resource(TM) Center Offers Broad Range of Solutions with Single Ended Primary Inductance Converter (SEPIC) Topology for Numerous Low Voltage Applications

Voxelle ships Personal VoIP Gateway chipset for Skype

Siano Mobile Silicon Unveils World's Lowest Power Consumption Mobile Digital TV Receiver; Multi-band, Multi-standard Receiver Chipset Offers a Low Cost, Easy to Design Solution for Fast Integration of Digital TV into Mobile Devices

Diamond High Voltage Schottky Diode Announced by Element Six

Texas Instruments Breaks 65nm Leakage Power Barrier with SmartReflex(TM) Technologies

Cypress Unveils Industry's First Firmware-Programmable USB2.0 NAND Controller; Single-Chip EZ-USB(TM) NX2LP-Flex Controller Enables Value Added Features in NAND Flash-Based Thumbdrives

Vitesse Enhances Baseboard and Enclosure Management Controller Family

Cypress Introduces TouchWake(TM) Capability for WirelessUSB(TM) Radio-on-a-Chip Devices; New Feature Allows Wireless Mice and Other Peripherals to Wake from Sleep Mode When Touched, Extending Battery Life and Improving Performance

TI Integrates Smart Battery and Power Management Technology on Single Chip

New Agere Systems Storage Chip Increases Disk Drive Capacity for Portable Consumer Devices Through Superior Perpendicular Recording Performance

IDT Offers Leading Network Search Engines in RoHS-Compliant Flip-Chip Packaging; Leading Communications IC Company Improves Environmental Program, Offering its Entire Product Portfolio in RoHS-compliant Packages

Intersil Introduces New Family of Volatile, 32-Tap Digitally Controlled Potentiometers for Ultra-Low-Power Applications

Sequoia Communications Releases the Industry's First Single-Chip, Multi-Mode WEDGE RF Transceiver; Company's WEDGE Device Sets New Standards in Cost and Power Consumption for 3G Handsets

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Review Article
  • Uploading avatar May 23, 2009
    Reviewed by 'greatterrakomp'
    Hello, everyone! Nice forum, nice discussions!

    Can you, guys, tell me how i can upload an avatar so that it could be displayed with all my posts? i'm just newbe in using forums and can't find this feature here.

    P.S. i'm sorry, may be i'm posting to the wrong category, but i just want to use all features of the board.

      Was this review helpful to you?   (Report this review as inappropriate)

  • October 09, 2008
    Reviewed by 'prag_79'
    A good article ,giving incite into the latest strategy employed by Cadence in develpment of high performance physical verification tool that can dramatically speed up design closure as claimed.

      Was this review helpful to you?   (Report this review as inappropriate)

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