Sonics and Summit Design Team to Accelerate Industrywide SystemC Platform SoC Transformation; Summit to Distribute Sonics SMART Interconnect SystemC Models as Part of Recently Launched IP Initiative
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Sonics and Summit Design Team to Accelerate Industrywide SystemC Platform SoC Transformation; Summit to Distribute Sonics SMART Interconnect SystemC Models as Part of Recently Launched IP Initiative

MOUNTAIN VIEW, Calif.—(BUSINESS WIRE)—July 19, 2006— Sonics Inc.(R), the premier supplier of system-on-chip (SoC) SMART Interconnect(TM) solutions, and Summit Design, Inc., a leading provider of electronic system-level (ESL) design solutions, today announce a broad agreement by which Summit will distribute SystemC language versions of Sonics' SMART Interconnect solutions that operate seamlessly within Summit's Panorama(TM) and Vista(TM) design environments.

The collaboration between Sonics and Summit Design makes available a comprehensive SystemC modeling environment, based on the Open SystemC Initiative (OSCI) standard that directly addresses critical design challenges surrounding system-on-chip (SoC) development today. The SystemC models of Sonics' SMART Interconnects will be integrated with advanced system-level architectural exploration capabilities found in Panorama, to provide the key linkage that enables better architectural characterization of the SoC device under development, throughout all the SoC development teams. These models will support Vista's advanced debugging and verification capabilities to simplify assembly and verification of SoCs that incorporate Sonics SMART Interconnects.

"We are pleased to announce the availability of the SMART Interconnect models through our recently established IP initiative and to support interoperability of these models with the other models in our IP portfolio," says Emil Girczyc, president and CEO of Summit Design, Inc. "Customers using Sonics' SystemC SMART Interconnect models will have the full support of Vista's advanced debug features and Panorama's architectural performance and power analysis, which enables design teams to simplify and accelerate their system-level design. Through this partnership we will offer our mutual customers the best ESL design environment available."

For direct sale, Summit Design will offer SystemC-based versions of the Sonics SMART Interconnect solutions that are compatible with the Vista and Panorama design environments. Summit will also sell a limited function version of SonicsStudio(TM), a tool used to configure the SystemC versions of Sonics SMART Interconnect solutions which provides customers with 'one-stop shopping' through Summit Design for their Sonics SystemC needs.

A fully-featured version of SonicsStudio, available from Sonics, can then convert the same SystemC model configuration data developed in the Panorama environment into a Verilog HDL version, guaranteeing a rapid transition from architectural exploration into logical and physical design for any given chip using the Panorama modeling approach.

"The partnership announced with Summit continues Sonics' commitment to provide SMART Interconnect customers with the most comprehensive SystemC modeling environments available today," says Grant Pierce, president and CEO, Sonics Inc.

Demonstrations of Sonics SMART Interconnect solutions, in Vista and Panorama, will be conducted July 24-27 in Summit Design's booth #1028 at the Design Automation Conference (DAC), July 24-27 at Moscone Center in San Francisco.

About Sonics

Sonics, Inc. (R) is the premier supplier of SMART Interconnect(TM) solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics' SMART Interconnects solutions in leading products in the wireless, digital multimedia and communications markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corporation, Samsung Ventures, and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see

About Summit

Summit Design's industry-leading ESL and HDL solutions enable SOC companies to deliver products that meet system-level performance and power targets with dramatically reduced schedule risk. Summit's products address engineering challenges met during the specification and implementation design phases of complex hardware/software systems. Panorama(TM) allows designers to perform real-time application emulation of both the hardware and software portions of an embedded SoC, before core and IP selections are finalized. Vista(TM) is an integrated development environment (IDE) for SystemC that combines both hardware and software concepts to speed design and debug of SystemC and TLM applications. Visual Elite(TM) is a state-of-the-art design, integration and verification platform which enables designers to intuitively capture and validate their designs using high-level design techniques and languages. Top electronics companies worldwide, including leaders in the wireless, automotive, and consumer electronics space, have achieved dramatic reductions in design cycle time through their use of Summit's products. Summit Design is headquartered in Los Altos, California, with offices throughout the US, Europe, Japan, Israel, and ROA. To learn more, please visit

Sonics Inc. and the company's logo are registered trademarks, and SMART Interconnects and SonicsStudio are trademarks of Sonics, Inc. Vista and Panorama are trademarks of Summit Design, Inc. All other trademarks are the property of their respective owners.

Fast Forward Public Relations (for Sonics)
Mary Jane Reiter, 408-725-1239

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Summit Design 
Francine Bacchini, 408-839-8153

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