Apache Hits Eighteenth Consecutive Quarter of Record Sales

MOUNTAIN VIEW, Calif.—(BUSINESS WIRE)—July 24, 2007— Apache Design Solutions, the technology leader in SoC power integrity today announced that the company has achieved its 18th consecutive quarter of record sales with over 15% growth from the previous quarter and 50% growth from Q2 of the previous year, while continuing profitability. In addition, Apache opened two new R&D centers in Hsin-chu, Taiwan and Shanghai, China. These development centers are in addition to the existing R&D centers in Chengdu, China and Bangalore, India.

Recognizing power as a system-wide challenge, not just an IC related issue, Apache recently introduced Sentinel; a combined chip-package power and I/O integrity solution. Sentinel for Chip Power Model (CPM) and I/O-SSO are being used by early adopters to solve their IC-Package co-design needs.

"We are scaling our business and technology to address the critical 45 / 32 nm silicon integrity challenges for digital SoC, memory, and mixed-signal designs," said Andrew Yang, CEO of Apache. "The global expansion strategy is a critical part of our business execution and delivery of key technologies."

About RedHawk

RedHawk is a full-chip Vectorless Dynamic(TM) power integrity solution for power closure sign-off of nanometer SoC designs. Correlated with silicon measurements and SPICE, RedHawk addresses dynamic power issues such as simultaneous switching output (SSO) for core, memory, clock, and I/O, as well as effects of on-chip inductance, package RLC, and decoupling capacitance. With RedHawk, designers can identify dynamic "hot spots," examine its impact on timing, accurately pinpoint the cause of dynamic voltage drop, and automatically repair the source of supply noise. RedHawk enables designers to reach power closure sign-off for high performance SoCs, including those utilizing ultra-low-power design techniques such MTCMOS (power-gating), substrate back-biasing, and on-chip LDO voltage regulators.

About Sentinel

Sentinel is the industry's first combined chip-package-board power and I/O integrity solution. It combines chip's core switching power delivery network, I/O sub-system, and package / PCB models in a single environment for accurate IC-Package co-design from early prototyping to signoff. Sentinel includes compact, Spice-compatible chip power model (CPM) including LC resonance along with high capacity I/O-SSO (SSO) solutions for optimal pad/package selection and electro-magnetic interference (EMI) for EMI noise source modeling.

About Apache Design Solutions

Apache delivers the leading power sign-off solution adopted by 80% of top IDM, fabless semiconductor, and foundries and a complete platform solution for silicon integrity of SoC, analog IP, and system designs. Apache's innovative platform considers all sources of noise that impacts the design - such as power, signal, package / system IO, substrate, and temperature. Apache's silicon integrity platform enables designers of leading networking, wireless, communication, consumer, and semiconductor companies to detect, fix, and prevent design weaknesses that can result in reduced yield and failed silicon or system. Apache's vendor-neutral solutions enable designers to adopt any industry-standard physical design flow and are certified by TSMC's Reference Flows (NYSE: TSM). For more information, visit www.apache-da.com.

Apache Design Solutions, NSPICE, RedHawk, PsiWinder, Sahara, Sentinel, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc.

Contact:

Apache Design Solutions
Yukari Ohno, 650-641-4200
Email Contact
or
Public Relations for Apache
Cayenne Communication
Michelle Clancy, 252-940-0981
Email Contact


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Review Article
  • October 09, 2008
    Reviewed by 'tomas2559'
    I don't understand why this article from Apache Design talks about their sales growth but does not inlcude any figures about what their actual sales were. Pretty lame if you ask me.

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