STMicroelectronics Reports 2009 First Quarter Financial Results

    --  In power discretes, ST announced a performance breakthrough for power
        MOSFETs by achieving the best on-resistance per die area with its
        MDmesh(TM) V technology. ST also introduced a series of 30V power
        transistors, based on its STripFET(TM) VI DeepGATE(TM) process,
        achieving an increase in energy efficiency in applications such as
        computers and telecom and networking equipment. ST also gained numerous
        power MOSFET design wins, largely in LCD TV applications, in particular
        from a major Korean TV maker, but also with leading automotive and
        computer customers.

    --  In protection devices, ST introduced various innovative
        ultra-low-capacitance ESD (electro-static discharge) protection and
        signal-booster devices dedicated to HDMI transmitters, mobile phones,
        digital cameras and PVRs (Personal Video Recorders). In the power
        management area, ST gained market success with avalanche-rated Power
        Schottky devices for adapters and desktop power supplies. And in power
        conversion, ST gained design wins for voltage regulator and
        power-controller devices in computer and industrial-lighting

    --  In advanced analog, ST gained design wins in temperature sensors and
        smart reset ICs and also sampled clock-distribution ICs to numerous
        world-leading mobile phone makers. In analog linear ICs, ST launched new
        devices including: a two-channel 2.8W class-D stereo audio amplifier IC
        featuring 3D effects to improve sound in portable equipment; a new
        broadband signal amplifier IC for multimedia networking applications;
        and a single-chip video filter/buffer for consumer products. ST also
        achieved multiple design wins for linear devices with world-leading
        consumer and mobile phone makers.

Technology Highlights

    --  ST entered into a strategic cooperation with Paratek to supply
        radio-frequency (RF) tunable products for mobile phones using STs' IPAD
        (Integrated Passives and Active Devices) technology. The two companies
        will advance the next generation of Paratek's ParaScan materials
        technology for high-volume manufacturing, and will develop RF tunable
        products to improve 'total radiated power' for mobile phones, leading to
        longer battery life and fewer dropped calls.

ST-Ericsson Highlights

    --  On February 12, 2009, ST-Ericsson was formally launched revealing its
        name, management team and positioning.

    --  In February, the company announced its cooperation with Nokia to provide
        a next-generation smart phone platform for Symbian Foundation, with a
        reference platform based on ST-Ericsson's U8500 single chip.

    --  Also in February the company announced its collaboration with ARM to
        demonstrate the world's first Symmetric Multi Processing mobile platform
        technology running on Symbian OS.

    --  In March, the company launched fully integrated single-chip solutions
        for feature-rich, low-cost handsets. ST-Ericsson's 4910 and 4908 EDGE
        platforms combine the industry's highest level of integration and
        cost-efficiency, with both digital and analog basebands, RF transceiver
        and power management unit (PMU) in a single chip.

    --  A next-generation mobile audio digital-to-analog converter (DAC) for the
        mobile music market was also launched. ST-Ericsson's STw5211 further
        extends the company's wide portfolio of audio solutions with enhanced

All of STMicroelectronics' press releases (including all releases in Q1) are available at All of ST-Ericsson's press releases (including all releases in Q1) are available at

DeepGATE, MDmesh, STripFET and VIPower are trademarks of STMicroelectronics. All other trademarks or registered trademarks are the property of their respective owners.

Use of Supplemental Non-U.S. GAAP Financial Information

This press release contains supplemental non-U.S. GAAP financial information, including adjusted gross profit (margin) or operating income, adjusted net earnings/loss per share, net operating cash flow and net financial position.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information by other companies.

See Attachment A of this press release for a reconciliation of the Company's non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with the Company's consolidated financial statements prepared in accordance with U.S. GAAP.

Forward-looking information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management's current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those in such statements due to, among other factors:

    --  Effect of the current economic downturn on  demand in the key
        application markets and from key customers served by our products, and
        changes in customer order patterns, including order cancellations, all
        of which generate uncertainties and  make it extremely difficult to
        accurately forecast and plan our future business activities;
    --  our ability to adequately utilize and operate our manufacturing
        facilities at sufficient levels to cover fixed operating costs
        particularly at a time of decreasing demand for our products as well as 
        the financial impact of obsolete or excess inventories if actual demand
        differs from our anticipations;
    --  the impact of intellectual property claims by our competitors or other
        third parties, and our ability to obtain required licenses on reasonable
        terms and conditions;
    --  the outcome of ongoing litigation as well as any new litigation to which
        we may become a defendant;
    --   our  ability  to  successfully  integrate  the  acquisitions  we  pursue,  in
                particular  the  merger  of  ST-NXP  Wireless  with  Ericsson  Mobile  Platforms
                ("EMP")  to  form  ST-Ericsson  in  the  current  difficult  economic
        --    we  hold  significant  non-marketable  equity  investments  in  Numonyx  ,  our
                joint  venture  in  the  flash  memory  market  segment,  and  in  ST-Ericsson,
                our  joint  venture  in  the  wireless  segment.  Additionally,  we  are  a
                guarantor  for  certain  Numonyx  debts.  Therefore,  declines  in  these  market
                segments  could  result  in  significant  impairment  charges,  restructuring
                charges  and  gains/losses  on  equity  investments;
        --    our  ability  to  manage  in  an  intensely  competitive  and  cyclical  industry,
                where  a  high  percentage  of  our  costs  are  fixed  and  are  incurred  in
                currencies  other  than  U.S.  dollars  as  well  as  our  ability  to  execute  our
                restructuring  initiatives  in  accordance  with  our  plans  if  unforeseen
                events  require  adjustments  or  delays  in  implementation;
        --    our  ability  in  an  intensively  competitive  environment  to  secure  customer
                acceptance  and  to  achieve  our  pricing  expectations  for  high-volume
                supplies  of  new  products  in  whose  development  we  have  been,  or  are
                currently,  investing;
        --    the  ability  to  maintain  solid,  viable  relationships  with  our  suppliers
                and  customers  in  the  event  they  are  unable  to  maintain  a  competitive
                market  presence  due,  in  particular,  to  the  effects  of  the  current
                economic  environment;
        --    changes  in  the  political,  social  or  economic  environment,  including  as  a
                result  of  military  conflict,  social  unrest  and/or  terrorist  activities
                ,economic  turmoil    as  well  as  natural  events  such  as  severe  weather,
                health  risks,  epidemics  or  earthquakes  in  the  countries  in  which  we,  our
                key  customers  or  our  suppliers,  operate;  and
« Previous Page 1 | 2 | 3 | 4 | 5 | 6 | 7  Next Page »

Review Article Be the first to review this article
Featured Video
Roberto FrazzoliEDACafe Editorial
by Roberto Frazzoli
Discovering Cadence Integrity 3D-IC platform
More Editorial  
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Breker’s Maheen Hamid Appointed to SEMI ESD Alliance Governing Council
Vincent ThibautArteris IP Blog
by Vincent Thibaut
Why Automate Traceability?
Logic Design Engineer for Intel at Santa Clara, California
Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California
Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California
Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California
Sr Engineer - RF/mmWave IC Design for Global Foundaries at Santa Clara, California
Pre-silicon Design Verification Engineer for Intel at Santa Clara, California
Upcoming Events
DVCon Europe 2021 at Germany - Oct 26 - 27, 2021
SemIsrael Expo 2021 - November 9, 2021 at Avenue Convention Center, Israel Haifa Israel - Nov 9, 2021
Semicon West Hybrid 2021 at Moscone North and South San Francisco, CA - Dec 7 - 9, 2021
67th Annual IEEE International Electron Devices Meeting at Hilton San Francisco Union Square hotel San Francisco - Dec 11 - 15, 2021

© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise