Integrated baluns save 70% of board space, simplify design and maximize RF performanceGENEVA, May 21 — (PRNewswire) — Two new ICs from STMicroelectronics (NYSE: STM), a world leader in components for mobile and consumer markets, allow designers to connect an antenna to a Bluetooth transceiver using a single chip, making Bluetooth-enabled products simpler, smaller and easier to build.
The BAL-2593D5U and BAL-2690D3U are integrated baluns, used to convert the antenna signal to a balanced pair of signals as required by the Bluetooth transceiver. As replacements for traditional baluns built with discrete components, the new devices occupy up to 70% less printed-circuit-board area, simplify design and assembly, and ensure better balanced signal channels with low losses, thereby improving wireless performance.
The ICs comprise Integrated Passive Devices fabricated using ST's proven IPD-on-glass process, which delivers more predictable RF performance compared to other integrated baluns; some of which require additional external matching components.
The BAL-2593D5U is optimized for use with the STLC2500D standalone Bluetooth transceiver and STLC2592/3 combo devices, which implement an FM radio tuner enabling users to listen to radio directly on a Bluetooth headset. The BAL-2690D3U is designed to partner the STLC2690, a Bluetooth/FM-tuner combo that also adds a short-range FM transmitter allowing the user to play stored music through a system such as a car radio.
Key features of ST's integrated baluns:
- 50/50+j50 Ohm impedance
- 1.16 x 1.26mm footprint; sub-0.7mm profile
- 1.2dB insertion loss
- Matches STLC2592/3, STLC2500D
- 50/30+j25 Ohm impedance
- 0.91 x 0.91mm footprint; sub-0.7mm profile
- 0.8dB insertion loss
- Matches STLC2690
The BAL-2593D5U and BAL-2690D3U are in production now, in 4-bump flip-chip packages, priced at $0.25 for a minimum order of 5000 pieces; additional pricing options are available for higher quantities.
STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2009, the Company's net revenues were $8.51 billion. Further information on ST can be found at www.st.com.
Michael Markowitz of STMicroelectronics