Photo Stencil Presents Paper 3D Electroform Stencils for Two-Level PCBs at IPC APEX Expo 2015
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Photo Stencil Presents Paper 3D Electroform Stencils for Two-Level PCBs at IPC APEX Expo 2015

Poster Session on Wednesday, February 25, at 10:00-10:30AM and 4:30-5:00PM, room 6A

COLORADO SPRINGS, Colo. — (BUSINESS WIRE) — February 17, 2015Photo Stencil, LLC, a leading full-service provider of high-performance stencils and tooling, will present results of the paper 3D Electroform Stencils for Two-Level PCBs, at IPC APEX Expo 2015, San Diego, California on Wednesday, February 25, at 10:00-10:30 AM and 4:30-5:00 PM, in room 6A. The paper was written and will be presented by Rachel Miller-Short, Photo Stencil, in collaboration with William E. Coleman Ph.D., Photo Stencil, Dudi Amir, Intel, and Joseph Perault, Parmi.

“The requirements for two-level PCBs with components on both levels have seen a recent increase,” explained Rachel Miller-Short, VP global sales, Photo Stencil. “Stencil printing on both levels requires special stencil and squeegee blade designs. Combining Photo Stencil’s expertise in stencil design and using Parmi’s solder paste inspection equipment to analyze the results, we decided to examine two requirements necessitated by these boards.”

The first requirement was printing solder paste for a .3µm µBGA with pads on two levels of the PCB separated by 7 mils (175µm). The second requirement was printing flux or solder paste into a recessed area on the PCB for an embedded flip chip. The cavity depth was 14 mils (350µm). 3D Electroform stencils were used for both print requirements. Rubber squeegee blades, metal squeegee blades, slit metal squeegee blades, and notched metal squeegee blades were tested. Print results, including paste volume and paste volume dispersion, were analyzed. Study conclusions, with thoughts for additional research, will be presented at the session.

Contact Photo Stencil at, call +1-719-304-4224, or visit Photo Stencil’s website


About Photo Stencil

Photo Stencil, LLC provides high-performance stencils, squeegee blades, thick film and metal mask screens, and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries. Its innovations include the patented AMTX E-FAB® electroformed stencils, high-performance, proprietary NicAlloy™, NicAlloy-XT™, laser-cut, and chemetch stencils, and patented electroformed E-Blade® squeegee blade. Stencil design support and customer-specific design libraries are also provided. Founded in 1979, Photo Stencil is headquartered in Colorado Springs and has a manufacturing facility in Mexico. For more information follow us on, visit, or email


Photo Stencil, LLC
Rachel Miller-Short, +1-719-304-4224
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AR Marketing, Inc. (agency)
Andrea Roberts, +1-858-204-9584
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