CEA-Leti Presenting 11 Papers at IEDM 2018 & Hosting Workshop on Discruptive Technologies for Data Management
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CEA-Leti Presenting 11 Papers at IEDM 2018 & Hosting Workshop on Discruptive Technologies for Data Management


 Invited Paper Will Address Breakthroughs In NEMS Resonators, Spectrometry and 3D Sequential Technologies

GRENOBLE, France – Nov. 7, 2018 – Leti, a technology research institute of CEA Tech, will present 11 papers at IEDM 2018 in San Francisco, Dec. 3-5, including one invited paper on scalable silicon quantum computing. It also will host a workshop covering “Disruptive Technologies for Data Management” on Sunday, Dec. 2, at the Nikko Hotel, anchored by a keynote talk from John Paul Strachan, senior researcher at HPE.

CEA-Leti’s workshop, an annual event for invited guests at the IEDMconference, begins at 5:30 p.m. Presentations include:

CEA-Leti’s papers at IEDM include:

Monday, Dec. 3

Session 7.2: Breakthroughs in 3D Sequential Technology

Time: 2:00 pm

Location: Continental Ballroom 6


Session 6.2: Towards Scalable Silicon Quantum Computing (invited)

Time: 2:00 pm

Location: Continental Ballroom 5


Session 7.3: Hybrid Bonding for 3D Stacked Image Sensors: Impact of Pitch Shrinkage on Interconnect Robustness

Time: 2:25 pm

Location: Continental Ballroom 6


Tuesday, Dec. 4

Session 12.4: Very Large Scale Integration Optomechanics: A Cure for Loneliness of NEMS Resonators?
Time: 9:00 am

Continental Ballroom 1-3


Session 17.1 Characterization Methodology and Physical Compact Modeling of in-Wafer Global and

Local Variability

Time: 9:05 am

Location: Plaza B


Session 17.6: Development of X-ray Photoelectron Spectroscopy Under Bias and its Application to Determine Band-energies and Dipoles in the HKMG Stack

Time: 11:35 am

Location: Plaza B


Session 20.3: In-depth Characterization of Resistive Memory-based Ternary Content Addressable


Time: 3:10 pm

Location: Continental Ballroom 4


Session 21.3: Tunability of Parasitic Channel in Gate-All-Around Stacked Nanosheets

Time: 3:10 pm

Location: Continental Ballroom 5


Session 18.4: Truly Innovative 28nm FDSOI Technology for Automotive Micro-Controller Applications Embedding 16MB Phase Change Memory
Time: 4:00 pm
Location:  Grand Ballroom B


Session 20.6: In-Memory and Error-Immune Differential RRAM Implementation of Binarized Deep

Neural Networks

Time: 4:50 pm

Location: Continental Ballroom 4

Wednesday, Dec. 5

Session 37.4: Optimized Reading Window for Crossbar Arrays Thanks to Ge-Se-Sb-N-based OTS Selectors
Time: 2:50 pm

Location: Continental Ballroom 4

About CEA-Leti (France)

Leti, a technology research institute at CEA Tech, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 2,700 patents, 91,500 sq. ft. of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. Leti has launched 60 startups and is a member of the Carnot Institutes network. This year, the institute celebrates its 50th anniversary. Follow us on www.leti-cea.com and @CEA_Leti.

Follow us on www.leti.fr/en and @CEA_Leti.

CEA Tech is the technology research branch of the French Alternative Energies and Atomic Energy Commission (CEA), a key player in innovative R&D, defence & security, nuclear energy, technological research for industry and fundamental science, identified by Thomson Reuters as the second most innovative research organization in the world. CEA Tech leverages a unique innovation-driven culture and unrivalled expertise to develop and disseminate new technologies for industry, helping to create high-end products and provide a competitive edge.

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