Ansys Multiphysics Solutions Certified By TSMC For High-Speed Next-Generation 3D-IC Packaging Technologies

TSMC leverages Ansys' multiphysics platform to analyze power, thermal and signal integrity for its CoWoS® and InFO technologies

PITTSBURGH, Aug. 26, 2020 — (PRNewswire) —  

Key Highlights

  • Ansys achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS® (Chip-on-Wafer-on-Substrate) and InFO (Integrated Fan-Out) 2.5D and 3D advanced packaging technologies
  • Ansys' comprehensive suite of power, thermal and signal integrity analysis engines simulate, calculate and alleviate reliability issues, enabling optimal electrical performance

Ansys (NASDAQ: ANSS) achieved certification of its advanced semiconductor design solution for  TSMC's high-speed CoWoS® with silicon interposer (CoWoS®-S) and InFO with RDL interconnect (InFO-R) advanced packaging technologies. This empowers customers to signoff power, signal integrity and analyze the impact of thermal effects to confirm the reliability of complete, integrated 2.5D and 3D silicon systems.  

TSMC certifies the Ansys® RedHawk and Ansys® RaptorH family of multiphysics solutions – including Ansys® Redhawk-SC Electrothermal – for next-generation CoWoS®-S and InFO-R advanced packaging technologies. The certification encompasses die and package co-simulation and co-analysis for extraction, power and signal integrity analysis, power and signal electromigration (EM) analysis and thermal analysis. This comprehensive suite of power, thermal, signal integrity and EM analysis tools will help simulate, calculate and alleviate reliability issues, enabling optimal electrical performance. 

"The result of our collaboration combining Ansys' multiphysics solutions and TSMC's CoWoS® and InFO advanced packaging technologies helps our mutual customers address their design complexity and challenges," said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. "Through our ongoing partnership with Ansys, customers can improve and validate their cutting-edge designs to satisfy stringent performance and reliability standards."

"To meet demanding reliability requirements for Wi-Fi systems, 5G mobile devices and high-speed wireless components, customers require a comprehensive multiphysics simulation solution that addresses power, reliability, and thermal issues across the entire chip, package and system," said John Lee, vice president and general manager, Ansys. "Collaborating with TSMC, our mutual customers will circumvent these challenges, enable first-time design success and expedite time to market with our leading-edge multiphysics simulation platform."

About Ansys

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS – T

 

Contacts


Media

Mary Kate Joyce

724.820.4368

marykate.joyce@ansys.com



Investors

Annette N. Arribas, IRC

724.820.3700

annette.arribas@ansys.com 

 

Cision View original content to download multimedia: http://www.prnewswire.com/news-releases/ansys-multiphysics-solutions-certified-by-tsmc-for-high-speed-next-generation-3d-ic-packaging-technologies-301118481.html

SOURCE Ansys

Contact:
Company Name: Ansys
Web: https://www.ansys.com
Financial data for Ansys




Review Article Be the first to review this article
Aldec


Featured Video
Latest Blog Posts
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
Specification-Driven UVM Testbench Generation
Colin WallsEmbedded Software
by Colin Walls
malloc() – just say no
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Invitation to Participate in VSDOpen2020
Jobs
Senior Application Engineer Formal Verification for EDA Careers at San Jose and Austin, California
Upcoming Events
VSDOpen 2020 Online Conference at India - Oct 10, 2020
2020 International Conference On Computer Aided Design at San Diego Mission Bay Resort San Diego CA - Nov 2 - 5, 2020
International Conference on Computer Aided Design (ICCAD) 2020 at San Diego Mission Bay Resort San Diego CA - Nov 2 - 5, 2020
TrueCircuits:



© 2020 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise