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September 26, 2005
New Physical Verification System from Cadence
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Si2 Forms New Open Modeling Coalition OMC will address critical issues -- such as accuracy, consistency, security, and process variations -- in the characterization and modeling of libraries and IP blocks used for the design of integrated circuits. The initial OMC Working Groups (WG) will address the proposed library standards for Effective Current Source Model (ECSM), Data Model Consistency, Statistical Timing and Characterization Data. Structured ASICs to Solve Cost and Design Issues in the IC Industry See last week's Editorial Other EDA News True Circuits Introduces New Line of High Resolution Clock Generator PLLs LSI Logic Adopts Synopsys' New Design Planning Capabilities for Industry-Leading ASICs STMicroelectronics and Synopsys Demonstrate Interoperability of Their SATA IP Cores for 90nm Technology Synopsys DesignWare Verification IP for AMBA 3 AXI is First to Earn ARM 'AMBA 3 Assured' Logo Certification Synopsys Speeds Development of High Performance Designs With AMBA 3 AXI Synthesizable IP in DesignWare Library Springer Publishes ARM-Synopsys Verification Methodology Manual for SystemVerilog Synopsys Announces Source-Code License for SystemVerilog Verification Library Global Unichip Collaborates With Cadence and Kilopass to Deliver Innovative Consumer Entertainment Designs Mentor Graphics Appoints New Vice President Sun Microsystems Servers With Solaris Operating System and UltraSPARC (R) Microprocessors Deliver up to Fivefold Performance Boost; Sun Captures Performance Lead From IBM, HP ADVISORY/ VaST Systems Technology CTO to Chair Compilation & Power Session at EMSOFT, Present at EMSOFT and PARC '05 Synopsys Extends Galaxy Design Platform with JupiterIO for Concurrent Die and Package Floorplanning and Analysis New Product Announcement: EverCAD to Deliver the Next Generation All-in-One Mixed-Signal Verification Solution, DIAMOND, for Complex Mixed-Signal SoC designers. Other IP & SoC News NEC Electronics America Announces New 8.4-Inch LCD With Ultra-Advanced, Super-Fine TFT Technology for Industrial Use Altera Receives Request for Information From SEC Avnet, Atmel Supercharge Battery Technology Inc.'s Design Process; New Laptop Batteries Are Now Smaller While Boasting Higher Performance Than Before CheckSum Provides Low-Cost In-Circuit with Boundary-Scan Test; Low-Cost Test Platform Delivers In-Circuit with Boundary-Scan Test for Under $70,000 MagnaChip Semiconductor Launches a One-Chip Solution for the Digital Still Camera Application Market STMicroelectronics Publishes Certified EEMBC Results for VLIW Core Used in High Performance Embedded Consumer Applications STMicroelectronics Introduces Step-Change in CPU Performance in Set-Top Box Decoder Chip WiSpry Names Nathan Silberman Vice President of Engineering SMSC Reports 58% Year-Over-Year Increase in Second Quarter Revenues, Including Oasis Acquisition; Revenues and Earnings Exceed Company's Prior Estimates ANADIGICS Raises Third Quarter 2005 Guidance Structured ASICs to Solve Cost and Design Issues in the IC Industry North American Semiconductor Equipment Industry Posts August 2005 Book-To-Bill Ratio of 1.05 Jetstream Media Technologies Announces Two New IP Core Products; Products to enable embedded digital effects for consumer electronic devices Knowlent Joins VSIA to Improve Analog IP Verification AMCC Sets New Standard for SATA II Hardware RAID With High Performance 3ware 9550SX Controllers; Available Now, 3ware 9550SX Hardware RAID Controllers Set the High Water Mark for I/O Performance Toshiba Announces New High Efficiency, Space Saving Multi-Chip Module for DC-DC Converters Semtech Leverages Packaging, Process Innovations in New 3.3V ESD Protection Device; New uClamp3324P Comes in Leadless Package That is up to 77% Smaller Than Competing Solutions; Flow-Through Design Simplifies Board Layout Spansion Demonstrates High-Density Flash Memory Solutions Based on 90nm MirrorBit Technology Conexant Expands India Management Team; Industry Veterans Fill President and Chief Operating Officer Positions Legerity Unveils Industry's Most Integrated VoWiFi Handset Chip and Software; The Le8100 WiFi Product Bundle Redefines Voice-over-WiFi SIP Telephony by Making It More Economical, Adaptable, and Power-Efficient Low-Power Tuner from Zarlink Targets Standard- and High- Definition Digital Satellite PayTV Systems National Semiconductor Delivers Multiple Innovations in Ethernet Transceivers Atmel Introduces First Power Management IC for Handset Add-on Modules White Electronic Designs Awarded $1.9 Million Contract for System-On-Chip Microprocessor Modules for Air-to-Air Missiles picoChip and ARM Announce 90NM Next-Generation Wireless Chipsets Broadcom's New Enterprise IP Phone Chip Brings Next-Generation Features and Capabilities to Mid-Range IP Phones Achronix Semiconductor Corporation Announces 650MHz FPGA and Early 2006 Release of 1+GHz Product Airgo Unlocks Door to Digital Home With First Wireless Chip to Outstrip Wired Speeds Fairchild Semiconductor's European Global Power Resource(TM) Center Offers Broad Range of Solutions with Single Ended Primary Inductance Converter (SEPIC) Topology for Numerous Low Voltage Applications Voxelle ships Personal VoIP Gateway chipset for Skype Siano Mobile Silicon Unveils World's Lowest Power Consumption Mobile Digital TV Receiver; Multi-band, Multi-standard Receiver Chipset Offers a Low Cost, Easy to Design Solution for Fast Integration of Digital TV into Mobile Devices Diamond High Voltage Schottky Diode Announced by Element Six Texas Instruments Breaks 65nm Leakage Power Barrier with SmartReflex(TM) Technologies Cypress Unveils Industry's First Firmware-Programmable USB2.0 NAND Controller; Single-Chip EZ-USB(TM) NX2LP-Flex Controller Enables Value Added Features in NAND Flash-Based Thumbdrives Vitesse Enhances Baseboard and Enclosure Management Controller Family Cypress Introduces TouchWake(TM) Capability for WirelessUSB(TM) Radio-on-a-Chip Devices; New Feature Allows Wireless Mice and Other Peripherals to Wake from Sleep Mode When Touched, Extending Battery Life and Improving Performance TI Integrates Smart Battery and Power Management Technology on Single Chip New Agere Systems Storage Chip Increases Disk Drive Capacity for Portable Consumer Devices Through Superior Perpendicular Recording Performance IDT Offers Leading Network Search Engines in RoHS-Compliant Flip-Chip Packaging; Leading Communications IC Company Improves Environmental Program, Offering its Entire Product Portfolio in RoHS-compliant Packages Intersil Introduces New Family of Volatile, 32-Tap Digitally Controlled Potentiometers for Ultra-Low-Power Applications Sequoia Communications Releases the Industry's First Single-Chip, Multi-Mode WEDGE RF Transceiver; Company's WEDGE Device Sets New Standards in Cost and Power Consumption for 3G Handsets You can find the full EDACafe event calendar here. To read more news, click here. -- Jack Horgan, EDACafe.com Contributing Editor.
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October 09, 2008
