Brian Faith, President & CEO QuickLogic

IPC APEX EXPO 2021 is the place to be...from wherever you are! IPC APEX

Hitendra Divecha & Brandon Bautz Cadence

EDACafe Editorial by Roberto Frazzoli Nvidia’s datacenter CPU; fast AI training on x86; Siemens acquires OneSpin; EDA Q4 results

IC Insights by IC Insights Chinese Companies Hold Only 5% of Global IC Marketshare

Bridging the Frontier by Bob Smith, Executive Director What’s on Tap from the ESD Alliance? Plenty! Read On …

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

SerDes Applications Design Engineer for Xilinx at San Jose, California

Senior Staff Field Application Engineer for Global Foundaries at Santa Clara, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Senior HID Sensor Algorithm Architect for Apple Inc at Cupertino, California

SoC Physical Design Engineer for Qualcomm at Austin, Texas

Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California

Simulation World at United States - Apr 20 - 21, 2021

Virtual ASMC 2021 at United States - May 10 - 12, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021