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ANSYS Simulation Tools Enable Integrated Circuits to Beat the Heat

Electronic devices are becoming smaller, denser, faster — and harder to keep cool. Heat adversely affects an integrated circuit’s reliability, and interconnecting a system's chips using 2.5-D interposers or 3-D stacking makes it increasingly difficult to operate within a device's thermal range. Before your product goes to market, use ANSYS simulation software to ensure its electronics beat the heat.
With ANSYS tools, you can simulate electronics cooling for printed circuit boards (PCBs) and collaborate closely with electrical or mechanical engineers to identify design obstacles and get fast, accurate results.



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