Dear Semiconductor Professional,
Tomorrow’s Technology – Delivered Today
The Common Platform Alliance of IBM, Samsung and GLOBALFOUNDRIES invites you join us at our technology forum on Tuesday, January 18. This free, daylong event will feature the Common Platform's innovative collaboration to deliver industry-leading technology that breaks new ground in performance and power efficiency for the 32/28nm technology nodes and beyond.
The technology forum features keynotes from industry leaders and presentations from senior members of the Common Platform partners. Topics include:
- Technical advancements of the innovative 32/28nm low-power high-k metal gate (HKMG) process technology optimized for the next generation of communications and smart mobile devices
- Technology innovations in SoC enablement solutions, materials science, process technology and manufacturing
- Proven design and manufacturing solutions from the alliance and its ecosystem partners
- The invention process and technology roadmap to 20nm and beyond
A key part of the forum will focus on collaboration for technology delivery, highlighting the rich and broad ecosystem of design enablement and implementation partners through a Partner Pavilion featuring leading EDA, IP, library, mask, back-end and design services companies.
Mark your calendar for this complimentary one-day technical event!
Please register early as seating is limited.
Common Platform Alliance