Videos -> 2018 ARM TechCon


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ANSYS Multiphysics Pervasive Simulation for Chip-Package-System Design
ANSYS
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Keywords: Low power, multiphysics, Automotive, Reliability, SeaScape, Power Integrity, Signoff, Vic Kulkarni, ANSYS, ARMTechCon 2018
Description: Interview with Vic Kulkarni, VP & Chief Strategist of ANSYS at ARM TechCon 2018


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Downstream : Solutuions for Post processing PCB Designs

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