e-con Systems

Accelerating PCB Assembly Quoting: Introducing Valor BOM Connector Siemens

IPC APEX EXPO 2021 is the place to be...from wherever you are! IPC APEX

EDACafe Editorial by Roberto Frazzoli EDA startup Avishtech innovates PCB stack simulation and loss modeling of PCB transmission lines

Bridging the Frontier by Bob Smith, Executive Director ESD Industry Revenue Increases more than $1B in 2020; Join us for Our CEO Outlook May 18

IC Insights by IC Insights Chinese Companies Hold Only 5% of Global IC Marketshare

Aldec Design and Verification by Farhad Fallahlalehzari How does the Mars Perseverance rover benefit from FPGAs as the main processing units?

Agnisys Automation Review by Anupam Bakshi Automating IP and SoC Development

Pre-silicon Design Verification Engineer for Intel at Santa Clara, California

Electronics Engineer for Lockheed Martin at Sunnyvale, California

Test and Measurement System Architect for Xilinx at San Jose, California

SerDes Applications Design Engineer for Xilinx at San Jose, California

Principle Engineer (Analog-Mixed-Signal Implementation) for Global Foundaries at Santa Clara, California

Technical Product Manager- SISW-EDA 238452 for Siemens AG at Fremont, California

Virtual ASMC 2021 at United States - May 10 - 12, 2021

DVCon China 2021 at Shanghai China - May 26, 2021

CadenceLIVE Americas 2021 at United States - Jun 8 - 9, 2021

DesignCon 2021 at San Jose McEnery Convention Center San Jose, CA San Jose CA - Aug 16 - 18, 2021