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Yervant Zorian, Chief Architect and FellowSynopsys 825
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Stuart Spencer, Sr. Sales ManagerAstronics Test Systems 872
Steve Pateras, Product Marketing DirectorMentor Graphics 1467
Steve Pateras, Product Marketing DirectorMentor Graphics 597
Steve Groden, Account ManagerProbeLogic 623
Stephen Pateras, Product Marketing DirectorMentor Graphics 820
Standup Comedy RoutineEDACafe.Com 752
Standup Comedian - Robert AitkenARM 862
Standup Comedian - Jayshree DesaiDefacto Tech 1023
Robert Aitken, R&D FellowARM 1648
Peter van den Eijnden, Managing DirectorJTAG Technologies 1393
Peter van den Eijnden, CEO and MDJTAG Technologies 1329
Paul Kingsepp, Product ManagerSL Power Electronics 1403
Pat ShaughnessyXJTag 1028
NI AWR Design Environment V14: Communications Library Enhancements for 5G and LTEAWR 724
N K Chari, Director Marketing & SupportKeysight Technologies 590
Multiphysics Approach for a Magnetron and Microwave Oven DesignCST 1240
Mike Vachon, Group DirectorCadence 1145
Mike Vachon, Group DirectorCadence 724
Mike Bartley CEO HW-SW verif leaders TVSTVS - Test and Verification 3667
Michael Yang, Senior TechnologistAnritsu 8082
Michael Junipa, General managerCheckPoint Technologies 1379
Linking RF Design Thru to TestAWR 1255
Kiran Vittal, Sr. Director of Product MarketingAtrenta 694
Kiran Vittal, Senior DirectorAtrenta 1276
Ken Harris, Director of MarketingPDF Solutions 1238
Jin Zhang, VP of Marketing and Customer RelationsOski Technology 1267
Jim Johnson & Dr. Hans ManhaeveSilicon Aid Solutions & Ridgetop Europe 1089
James Morgante, Field ApplicationAnritsu 7687
Ivan Petkov, Business Development ManagerAllegro DVT 1323
How Intel Makes Chips: Concept to CustomerIntel 410
Hagai Arbel, CEOVtool 2685
Getting Started with STM32F7ST Microelectronics 365
Getting Started with Atmel SAM V7Atmel 333
Geoffrey Rodgers, Sr Director Software SalesPDF Solutions 655
Dr. Yervant Zorian, Fellow & Chief ArchitectSynopsys 775
Detecting System-Level Corner Cases During Low-Power SoC VerificationCadence 333
Daniel Hansson, CEOVerifyter 732
Creating and Analyzing Multi Emitter Environment Test Signals with COTS EquipmentAgilent EESof 1285
CL Lou, CEOSTAr Technologies 893
Choon-Leong Lou, CEOSTAr Technologies 1855
Automotive PCBs: Efficient Signal and Power Integrity AnalysisCST 736
Arno Pettai, Senior TechnologistAnritsu 7917
Aftkhar Aslam, CTOyieldWerx 785
2019 ITC plenary Keynotes by Qualcomm & SynopsysSynopsys 286
2019 ITC Keynotes by Volkswagen and AdvantestAdvantest 313
2019 ITC Keynotes by NXP and MentorMentor 202
2019 ITC Keynotes by IBM and Mubadala VenturesIBM 256
2019 ITC Keynotes by EPFL and TeradyneTeradyne 242
2019 ITC Keynotes by DARPA and PDF SolutionsPDF Solutions 345
10GBASE-KR Electrical Conformance with Virtex®-7 FPGAsXilinx 1939
"New Instrumentation for Semiconductor Test",
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"Fast Analog Device Testing",
Sang Beng Ng
Aemulus 2840
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"3D TSV and Silicon Test",
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Total 57 links listed, not including links in sub-categories.

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