Excellent initiative about the future system-on-chip/system-in-package manufacturing reduction costs and technology improvement.
Unfortunately this initiative is addressing only FPGAs and GPUs application, it will be very interesting to have such initiative about silicon photonics together with CMOS ASIC system-in-package integration
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A*STAR’S IME LAUNCHES CHIP-ON-WAFER CONSORTIUM II AND COST
Juliano Oliveira 
